The flip chip COB is a real chip-level package, with no need to hit the wire, and the physical space size is only limited by the size of the light-emitting chip. Flip-chip COB, as an upgrade of COB, is based on the advantages of COB such as ultra-small dot pitch, high reliability, and non-glare surface light source. Further, improve the reliability, simplify the production process, better display effect, perfect near-screen experience, and realize the real chip-level pitch.

What is the difference between a traditional COB chip and a COB flip-chip?
1. Only flip-chip COB can realize the real chip-level pitch and reach the level of Micro LED. This is because, from the perspective of LED chips, Flip-Chip does not need to hit the wire, breaking the pixel pitch limit of regular chips and solving the metal migration problem in regular LEDs.

2. At the same time, each pixel unit has 6 metal bonding surfaces, which effectively solves the problem of bad wire breakage caused by dummy wire bonding and further improves the reliability. From the packaging point of view, the Flip-Chip COB package is a true chip-level integrated package with wireless bonding, and the physical space size is limited only by the size of the light-emitting chip, allowing for higher pixel density.

3. In terms of display performance, the Flip-Chip has a smaller area on the PCB board and the duty cycle of the substrate increases. It has a larger light-emitting area and can render darker black fields, higher brightness and higher contrast.

4. Present HDR level display effect. And there is no welding wire link, which effectively simplifies the production process and reduces the equipment investment cost. With the expansion of industrial scale, the product cost will be greatly reduced, especially when the dot pitch is less than 1.0mm, it will have a cost-competitive advantage.